Buried interfaces of packaging materials – adhesion
From cell phones to automobiles, the microelectronics industry has become ubiquitous in all facets of our daily lives. Device lifetime has always been a concern for this industry, and finding ways to extend it is a key area of research. To improve device lifetime, adhesives are frequently utilized and they must be researched in order to improve them. Typically, the polymer/adhesive buried interfaces are split apart and investigated ex situ, but, by using SFG spectroscopy we can investigate these interfaces in situ and noninvasively. In this project, various polymers and adhesives are investigated to determine their buried interfacial structure. We also perform plasma treatment, hygrothermal aging, and add silane adhesion promoters to determine what effect they have on the interfacial structure. In addition to spectroscopic probing, lap shear analysis is also performed, to correlate the macroscopic properties with the interfacial structure. By investigating polymer/adhesive interfaces with SFG spectroscopy we gain a better understanding of the fundamental interactions that are relevant in adhesion and how to improve these systems.